Optimizing Printed Circuit Board Assembly during the Design Process

This paper investigates the incorporation of optimization techniques early in the design process for the manufacturing process of printed circuit board (PCB) assembly. PCB design is a long process in which many sequential optimizations are performed with assembly optimization being the last. Since assembly optimization is not performed until the PCB design is completed it tends to be sub-optimal; however, engineers are reluctant to change the PCB design at that late stage due to market pressure for quick product introduction. This paper proposes a model which incorporates a PCB assembly optimization model into the PCB design stage when board layout occurs. The mathematical optimization model utilizes the available incomplete design information and provides a satisficing PCB layout with respect to routing performance and assembly objectives. A decision-making model is applied to facilitate the design engineer in harmonizing differences between the optimal assembly layout and the optimal electrical performance (routing) layout. The approach will enable the design engineer to analyze the trade-offs between cost (assembly) and performance (routing). The expected benefits are to reduce manufacturing cost and improve firstpass yield of the PCB. The methodology will be benchmarked against current approaches to quantify the improvements in manufacturability. Results of this work are illustrated and validated with several test cases.